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[原创]NXP i．MX RT1170高端ARM处理器开发方案

NXP公司的i.MX RT1170是i.MXRT系列产品的新高端处理器,集成了高性能工作高达1GHz的ArmCortex®-M7核和工作高达400MHz的能效Cortex®-M4核. i.MX RT1170处理器有2MB片上RAM,包括可灵活配置TCM(和M7 TCM共享的512KB RAM 以及和M4 TCM共享的256KB RAM) 768KB RAM或通用片上RAM.器件集成了先进的功率管理模块和DC/DC与LDO稳压器,降低了外部电源的复杂性,简化了加电次序.i.MX RT1170还提供各种存储器接口包括SDRAM,RAWNAND FLASH,NOR FLASH, SD/eMMC, Quad/Octal SPI, HyperRAM/Flash以及各种连接外设如WLAN, Bluetooth™,GPS, 显示器和照相机传感器.此外,器件还具有丰富的音频和视频特性如MIPICSI/DSI, LCD显示器,图像加速器,照相机接口,SPDIF和I2S音频接口.i.MX RT1170主要用在工业人机接口(HMI),马达控制,家用电器,高端音频设备,低端仪表盘和销售终端(PoS).本文介绍了i.MX RT1170主要特性,系统框图和评估板i.MX RT1170 EVK主要技术和功能指标,电路图,材料清单和PCB设计图.

The i.MX RT1170 is a new high-end processor of i.MXRT family, which features NXPs advancedimplementation of a high performance ArmCortex®-M7 core operating at speeds up to 1 GHz and apower efficient Cortex®-M4 core up to 400 MHz.

The i.MX RT1170 processor has 2 MB on-chip RAM intotal, including a 768 KB RAM which can be flexiblyconfigured as TCM (512 KB RAM shared with M7 TCMand 256 KB RAM shared with M4 TCM) orgeneral-purpose on-chip RAM. The i.MX RT1170integrates advanced power management module withDCDC and LDO regulators that reduce complexity ofexternal power supply and simplifies power sequencing.

The i.MX RT1170 also provides various memoryinterfaces, including SDRAM, RAW NAND FLASH,NOR FLASH, SD/eMMC, Quad/Octal SPI, HyperRAM/Flash, and a wide range of other interfaces forconnecting peripherals, such as WLAN, Bluetooth™,GPS, displays, and camera sensors. The i.MX RT1170also has rich audio and video features, including MIPICSI/DSI, LCD display, graphic accelerator, camerainterface, SPDIF, and I2S audio interface.

The i.MX RT1170 is specifically useful for applications such as:

• Industrial Human Machine Interfaces (HMI)

• Motor Control

• Home Appliance

• High-end Audio Appliance

• Low-end Instrument Cluster

• Point-of-Sale (PoS)

i.MX RT1170主要特性:

The i.MX RT1170 processors are based on Arm Cortex®-M7 Core™ Platform, which has the followingfeatures:

• The Arm Cortex-M7 Core Platform:

— 32 KB L1 Instruction Cache and 32 KB L1 Data Cache

— Floating Point Unit (FPU) with single-precision and double-precision support of Armv7-MArchitecture FPv5

— Support the Arm®v7-M Thumb instruction set, defined in the Armv7-M architecture

— Integrated Memory Protection Unit (MPU), up to 16 individual protection regions

— Up to 512 KB I-TCM and D-TCM in total

— Frequency of 1 GHz with Forward Body Biasing (FBB)

— ECC support for both cache and TCM

— Frequency of the core

• The Arm Cortex®-M4 Core platform:

— Cortex-M4 processor with single-precision FPU defined by Armv7-M architecture FPv4-SP

— Integrated MPU with 8 individual protection regions

— 16 KB Instruction Cache, 16 KB Data Cache, and 256 KB TCM

— Frequency of 400 MHz without body biasing

— ECC support for both cache and TCM

The SoC-level memory system consists of the following additional components:

— Boot ROM (256 KB)

— On-chip RAM (2 MB in total)

– Configurable 512 KB RAM shared with M7 TCM

– 256 KB RAM shared with M4 TCM

– Dedicated 1.25 MB OCRAM

— Secure always-on RAM (4 KB)

• External memory interfaces:

— 8/16/32-bit SDRAM, up to SDRAM-133/SDRAM-166/SDRAM-200

— 8/16-bit SLC NAND FLASH

— SD/eMMC

— SPI NOR/NAND FLASH

— Parallel NOR FLASH with XIP support

— Single/Dual channel Quad SPI FLASH with XIP support

— Hyper RAM/FLASH

— OCT FLASH

— Synchronization mode for all devices

• Timers and PWMs:

— Six General Programmable Timer (GPT) modules

– 4-channel generic 32-bit resolution timer for each

– Each supports standard capture and compare operation

— Two Periodical Interrupt Timer (PIT) modules

– Four timers for each module

– Generic 32-bit resolution timer

– Periodical interrupt generation

— Four Quad Timer (QTimer) modules

– 4-channel generic 16-bit resolution timer for each

– Each supports standard capture and compare operation

– Quadrature decoder integrated

— Four FlexPWMs

– Up to 8 individual PWM channels for each

– 16-bit resolution PWM suitable for Motor Control applications

— Four Quadrature Decoders

— Four Watch Dog (WDOG) modules

Each i.MX RT1170 processor enables the following interfaces to external devices (some of them aremuxed and not available simultaneously):

• Display Interface:

— Parallel RGB LCD interface (eLCDIF)

– Support 8/16/24-bit interface

– Support up to WXGA resolution @60fps

– Support Index color with 256 entry x 24-bit color LUT

— Parallel RGB LCD Interface Version 2 (LCDIFv2)

– Enhanced based on LCDIF version

– Support up to 8 layers of alpha blending

— MIPI Display Serial Interface (MIPI DSI)

– PHY integrated

– 2 data lanes interface with up to 1.5 GHz bit rate clock

— Smart LCD Display with 8080 interface through SEMC

• Audio:

— SPDIF input and output

— Four Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, and

codec/DSP interfaces

— Medium Quality Sound (MQS) interface via GPIO pads

— PDM microphone interface with 4 pairs of inputs

— Asynchronous Sample Rate Converter (ASRC)

• Graphics engine:

— Generic 2D (PXP)

– BitBlit

– Flexible image composition options—alpha, chroma key

– Porter-duff blending

– Image rotation (90°, 180°, 270°)

– Image resize

– Color space conversion

– Multiple pixel format support (RGB, YUV444, YUV422, YUV420, YUV400)

– Standard 2D-DMA operation

— Vector Graphics Processing

– Real-time hardware curve tessellation of lines, quadratic, and cubic Bezier curves

– 16x Line Anti-aliasing

– OpenVG 1.1 support

– Vector Drawing

• Camera Interface:

— Parallel Camera Sensor Interface (CSI)

– Support 24-bit, 16-bit, and 8-bit input

– Barcode binarization and histogram statistics

— MIPI Camera Serial Interface (MIPI CSI)

– PHY integrated

– 2 data lanes interface with up to 1.5 GHz bit rate clock

• Connectivity:

— Two USB 2.0 OTG controllers with integrated PHY interfaces

— Two Ultra Secure Digital Host Controller (uSDHC) interfaces

– eMMC 5.0 compliance with HS400 support up to 400 MB/sec

– SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100 MB/sec

– Support for SDXC (extended capacity)

— One 10M/100M Ethernet controller with support for IEEE1588

— One Gigabit Ethernet controller with support for AVB

— One Gigabit Ethernet controller with Time Sensitive Networking (TSN) Capability

— Twelve universal asynchronous receiver/transmitter (UARTs) modules

— Six I2C modules

— Six SPI modules

— Three FlexCAN (with Flexible Data-rate supported) modules

— Two EMV SIM modules

• Analog:

— Two Analog-Digital-Converters (ADC), which supports both differential and single-end inputs

— One Digital-Analog-Converter (DAC)

— Four Analog Comparators (ACMP)

• GPIO and Pin Multiplexing:

— General-purpose input/output (GPIO) modules with interrupt capability

— Input/output multiplexing controller (IOMUXC) to provide centralized pad control

— Two FlexIO modules

— 8 x 8 keypad

The i.MX RT1170 processors integrate advanced power management unit and controllers:

• Full PMIC integration, including on-chip DCDC and LDOs

• Temperature sensor with programmable trim points

• Hardware power management controller (GPC)

The i.MX RT1170 processors support the following system debug:

• Arm CoreSight debug and trace architecture

• Trace Port Interface Unit (TPIU) to support off-chip real-time trace

• Cross Triggering Interface (CTI)

• Support for 5-pin (JTAG) and SWD debug interfaces

Security functions are enabled and accelerated by the following hardware:

• High Assurance Boot (HAB)

• Cryptographic Acceleration and Assurance (CAAM) module:

— Public Key Cryptography Engine (PKHA)

— Symmetric Engines

— Cryptographic Hash Engine

— Random Number Generation (RNG4)

— Four Job Rings for use by processors

— Secure Hardware-Only Cryptographic Key Management

— Encrypted Boot

— Revision control check based on fuse values

— DEK includes IV

— Side channel attack countermeasures

• Inline Encryption Engine (IEE):

— External memory encryption/decryption

— I/O direct encrypted storage and retrieval (Stream Support)

— FlexSPI decryption only

• On-the-Fly AES Decryption (OTFAD):

— AES-128 Counter Mode On-the-Fly Decryption

— Hardware support for unwrapping “key blobs”

— Functionally acts as a slave sub-module to the FlexSPI

• Secure Non-Volatile Storage (SNVS):

— Secure real-time clock (SRTC)

— Zero Master Key (ZMK)

— Tamper protection

— DryICE

• Secure always-on RAM (4 KB)

• Secure key management and protection

— Physical Unclonable Function (PUF)

— UnDocumented Function (UDF)

• Secure and trusted access control

图1. i.MX RT1170系统框图

评估板i.MX RT1170 EVK

The i.MX RT1170 EVK provides a high-performance solution in a highly integrated board. It consists of a 6-layer PCB with through hole design for better EMC performance at a low cost, and it includes key components and interfaces.

评估板i.MX RT1170 EVK技术和功能指标:

Processor	MIMXRT1176DVMAA 1 GHz Arm Cortex-M7 core 400 MHz Arm Cortex-M4 core
Board Memory	512 Mbit SDRAM memory 512 Mbit Octal Flash 128 Mbit QSPI Flash 2 Gbit Raw NAND Flash 64 Mbit LPSPI Flash TF socket for SD card
Connectivity	2x Micro-USB OTG connectors Ethernet (10/100/1000M) connector Ethernet (10/100M) connector M.2 connector CAN transceivers ARDUINO^® interface - Expansion connectors need to be added FRDM motor control interface SIM card slot
Audio	Audio codec 4-Pole audio headphone jack External speaker connection Microphone (analog and digital) SPDIF Connector
Debug Capabilities	JTAG connector On-board DAP-Link debugger
Sensors	6-Axis ecompass (3-Axis Mag, 3-Axis Accel) sensor FXOS8700CQ
Expansion Connectors	MIPI^® LCD connector MIPI camera sensor connector
Additional	MCUXpresso Software and Tools, including MCUXpresso SDK with Amazon FreeRTOS^™ IAR Embedded Workbench^® IDE Keil^® IDE All-in-one board design 6-Layer through hole PCB