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The 3rd (2005) China Cell Phone Component Summit (CCS)
In Conjunction with Executive Committee Annual Session of China
Domestic Handset Summit
At the sites of CeBIT Asia 2005 & Telecon Expo China 2005
第三届(2005)中国手机元器件技术高峰会
暨国产手机企业首脑论坛2005年会
As China cell phone manufacturing industry’s most important technology event, the 3rd CCS’ will be held in Shanghai between May 12-13, 2005. With focal point on the emerging 3G-2.5G components technologies, the event will serve as face-to-face exchange platform for China cell phone OEM executives/CTO, design houses, components suppliers and concerned government officials/service providers. This Summit will shed lights to technology direction of the China cell phone industry and help Chinese OEMs/ODMs to formulate their R&D road maps.
Key Features:
  • This is the only gathering where Chinese mobile executives and technical chiefs meet once a year as organized in conjunction with Executive Committee Annual Session of China Domestic Handset Summit.
  • This is the only chance for mobile component suppliers present their technologies to the decision maker of China mobile manufacturers and has a face to face interaction with them.
  • China’s two major service providers, China Mobile & China Unicom will endorse and outline their technology directions and strategies during this event.
  • Time:
    May 12 Morning Speech
    Afternoon Speech
    Evening Dinner Reception
    May 13  Morning Speech
    Afternoon Round Table Face to Face Meeting
    Location:
    Intercontinental Hotel, Pudong, Shanghai
    Sponsors and Organizers:
  • China Ministry of Information Industry (MII)
  • China Mobile Communications Association (CMCA)
  • ChinaECNet Co., Ltd. (ChinaECNet)
  • China Domestic Handset Summit (CDHS)
  • Mobile Multimedia Technology Association (MMTA)
  • Support Media:
    《世界电子元器件》杂志 网易科技 搜狐 新浪
    Supported by:
  • China Unicom
  • China Mobile
  • China Telecom
  • China Netcom
  • On Site Symposium with Online Broadcast
    This Summit will be broadcasted online and interactive with telecommunication engineers nationwide. According to last year’s registration, we expect 1,200 online attendees in addition to 300 on-site audience.
    Symposium Covered Areas
  • DSP and Application processor
  • Memory Component
  • RF LNA and PA Module
  • Camera Module
  • Color Screen
  • Power Management
  • Passive Component
  • Topics of Emerging Technology
  • TV and Video Services on 3G Mobile Phone
       3G手机中的TV和视像服务
  • NOR+SDRAM+NAND Cards Trends in Mobile Phone Memory
       手机中的NOR+SDRAM+NAND存储器卡
  • Operation Systems and Application Software in 3G Mobile Phone
       3G手机中操作系统和应用软件
  • Multimode and Smart Mobile Phone Technology
       多模式和智能手机技术
  • Mobile Phone-PDA Technology
       手机+PDA技术
  • Emerging Embedded Function such as Radio and Game in 3G Mobile Phone
       3G手机中的新兴嵌入功能如无线电和游戏
  • Color Multimedia Display Technology in Mobile Phone
       手机中彩色多媒体显示技术
  • Saving more Energy and Power Management Technology in Mobile Phone
       手机中的节能和功率管理技术
  • New High Capacity Battery Technology
       新型高容量电池技术
  • Procedure
    Keynote speakers will have 30 minutes of presentation on site, which will be broadcasted online in a real time basis nationwide. The presentation will be followed by 10 minutes Q&A with questions from engineers on site as well as at different locations throughout China.
    Executive Round Table Meeting
    An Executive Round Table face-to-face discussion will be arranged in the afternoon of the second day. 24 China cell phone or mobile manufacturers will send out engineering representatives to participate in this Round Table and exchange with the representatives of components suppliers. A list of OEM/ODM representatives provided by CMCA is attached.
    Speaking Opportunity and Sponsorship Contact:
    Ms. Catherine Li
    Tel: 8610-8288-8222 ext.7009
    Email: Catherineli@eccn.com
    Registration/Participation Contact:
    Ms. May Zhang
    Tel:010-8288 8222 ext. 7012
    Fax:010-8288 8220
    Email: Mayzhang@eccn.com

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